LEAD FRAME AND SEMICONDUCTOR DEVICE USING NON-OHMIC MATERIAL

PROBLEM TO BE SOLVED: To improve abnormal-voltage inner-voltage characteristic and reliability by using non-ohmic material in a process for packaging or chip manufacture, so as to block the inflow of abnormal pulse such as an abnormal voltage or a surge voltage into a semiconductor chip. SOLUTION: In the lead frame, all the input/output pins 101 are connected at their one end with non-ohmic material 106 in a molding inner region (a). Electrodes 105 of ohmic contact material of Pt, Au, Ag or the like, are inserted into the interface where the non-ohmic material 106 and the input/output pins 101 are in contact. If an abnormal voltage or a surge voltage which is higher than an operation voltage flows via the input/output pins 101 into the packaged chip, the non-ohmic material 106 acts as a conductor material. On the other hand, if a normal input signal flows in, the non-ohmic material 106 acts as insulating material, thus transmitting all the normal input signals to the inside of the chip.