AROMATIC POLYIMIDE FILM AND COPPER FOIL-LAMINATED FILM

PROBLEM TO BE SOLVED: To obtain an aromatic polyimide film to be used as a support substrate in producing e.g. electronic circuits, high in travel stability during processing with good registration. SOLUTION: This tape-like aromatic polyimide film consists of an aromatic polyimide composed essential...

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Bibliographische Detailangaben
Hauptverfasser:	KONO TAKASHI, OTANI AKINORI, HOSOMA TOSHINORI, INOUE HIROSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain an aromatic polyimide film to be used as a support substrate in producing e.g. electronic circuits, high in travel stability during processing with good registration. SOLUTION: This tape-like aromatic polyimide film consists of an aromatic polyimide composed essentially of biphenyltetracarboxylic acid component and p-phenylenediamine component, having the following characteristics: thickness: 50-125μm, tensile strength: >=30kg/mm , tensile modulus: >=500kg/mm , linear expansion coefficient: