PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a printed wiring board which can improve solderability of an electronic component having hook leads, and enlarged conductor pattern area. SOLUTION: A printed wiring board has a through-hole 22 to pass hook leads 20 of a connector through. The through hole 22 is forme...

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Bibliographische Detailangaben
1. Verfasser:	HATAKEYAMA HIDETOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed wiring board which can improve solderability of an electronic component having hook leads, and enlarged conductor pattern area. SOLUTION: A printed wiring board has a through-hole 22 to pass hook leads 20 of a connector through. The through hole 22 is formed in a narrow and long shape in cross section, and its width is set slightly larger than the thickness of the hook leads 20. At both ends in the longitudinal direction of the periphery of an opening of the through-hole 22, pad sections 14a, 14b are formed for soldering the hook leads 20.