STRUCTURE OF MOUNTING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To make it possible to increase easily the mounting density of electronic components by a method wherein a cover to cover over the electronic components mounted on a circuit board is subjected to surface packaging on the circuit board and wiring patterns, which are connected wi...

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Bibliographische Detailangaben
1. Verfasser:	HORII KATSUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To make it possible to increase easily the mounting density of electronic components by a method wherein a cover to cover over the electronic components mounted on a circuit board is subjected to surface packaging on the circuit board and wiring patterns, which are connected with the electronic components, are formed on the cover. SOLUTION: A cover 12 provided in such a way as to cover over a group of small-sized electronic components 4 is mounted to the upper part of a circuit board 2 with a surface packaging. Moreover, electronic components 16 are respectively mounted on each of wiring patterns on the cover 12 subjected to surface packaging on the board 2 and each of these electronic components 16 is connected by continuity with each wiring pattern using solders 14. Furthermore, each wiring pattern, which is formed on the cover 12 and is mounted with each electronic component 16, is connected with each of wiring patterns, which are previously formed on the board 2, using solders 18.