CHIP CARRIER MODULE, INFORMATION PROCESSING SYSTEM AND FORMING METHOD

PROBLEM TO BE SOLVED: To provide a method of fitting a radiator or heat sink to an electronic component, and its resultant structure. SOLUTION: A heat sink 118 of aluminum or copper is glued to a ceramic cap 100 or an exposed semiconductor chip by the use of a silicon adhesive or flexible epoxy adhesive 120. Aluminum is covered by anode oxidation or chromate conversion, or copper can be covered by nickel or gold chromium. A structure like this is especially beneficial for fitting a flip chip. These adhesive agents contain materials having high thermal conductivities and low coefficients of thermal expansion(CTE), enhance heat performance, and improve the CTE difference between a silicon metal die and the metal of a heat sink.