LIQUID CRYSTAL DISPLAY PANEL

PROBLEM TO BE SOLVED: To suppress the extrusion of conductive particles from regions where contact is ought to be taken at the time of thermal press bonding and the subsequent increase of contact resistance by forming metallic films in the peripheral part regions of the regions, such as electrodes, where the contact is ought to be taken. SOLUTION: Ni films 5B having a thickness of about half the average grain size of the conductive particles are formed in the peripheral parts of the regions, such as electrodes, where the contact is ought to be taken, in a stage for thermally press bonding a semiconductor chip 3. Then, even if the conductive particles are tend to be extruded from the regions where the contact is ought to be taken at the time of thermal press bonding, the conductive particles 9A are detained by these Ni films 5B in the regions where the contact is ought to be taken and, therefore, the extrusion of these particles and the resultant increase of the contact resistance are suppressed. The problem in which the increase of the contact resistance varies with places and which deversely affects the display characteristics of the liquid crystal display device is suppressed.