LEAD FRAME FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent deterioration in the wire bonding property and solder wettability by forming a first Ni intermediate layer, second Co intermediate layer and Pd top layer in this order on a lead frame preform. SOLUTION: After degreasing and activating the surface of a Cu alloy lead f...

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Bibliographische Detailangaben
Hauptverfasser:	SERIZAWA SEIICHI, IGAWA MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent deterioration in the wire bonding property and solder wettability by forming a first Ni intermediate layer, second Co intermediate layer and Pd top layer in this order on a lead frame preform. SOLUTION: After degreasing and activating the surface of a Cu alloy lead frame preform 1, its entire surface is plated with Ni or Ni alloy to form a first intermediate layer 2 of 1μm, Co or a Co alloy of 0.05μm thickness plating is applied on the first layer 2 to form a second intermediate layer 3, and Pd or Pd alloy plated top layer 4 of 0.1μm thickness is formed on the second layer 3. Finally it is heat treated to provide a superior wire bonding property and solder wettability, without needing the high cost Au plating.