PIEZOELECTRIC WAFER GRIP FOR ROBOT BLADE

PROBLEM TO BE SOLVED: To provide the piezoelectric grip by which a semiconductor wafer or another workpiece is tightly fixed on a blade of a robot carrying mechanism during carrying of the semiconductor wafer between wafer manufacture process stations. SOLUTION: Piezoelectric grippers 106A-106D are...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAOR HERZEL, DONDE ARIK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HAND TOOLS MANIPULATORS PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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