PIEZOELECTRIC WAFER GRIP FOR ROBOT BLADE

PROBLEM TO BE SOLVED: To provide the piezoelectric grip by which a semiconductor wafer or another workpiece is tightly fixed on a blade of a robot carrying mechanism during carrying of the semiconductor wafer between wafer manufacture process stations. SOLUTION: Piezoelectric grippers 106A-106D are...

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Bibliographische Detailangaben
Hauptverfasser:	LAOR HERZEL, DONDE ARIK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHAMBERS PROVIDED WITH MANIPULATION DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HAND TOOLS MANIPULATORS PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide the piezoelectric grip by which a semiconductor wafer or another workpiece is tightly fixed on a blade of a robot carrying mechanism during carrying of the semiconductor wafer between wafer manufacture process stations. SOLUTION: Piezoelectric grippers 106A-106D are fitted onto a blade 100, and when an incremental voltage is applied to the grippers, they are moved to be engaged with a circumferential ridge of a semiconductor wafer 102. When the grippers are in contact with the wafer, the voltage applied to the grippers is kept constant to prevent further extension of the grippers. When all the grippers are in contact with the wafer, the voltage applied to each gripper is incremented by a prescribed voltage thereby increasing a force exerted to the wafer by each gripper and then the wafer is fixed onto the blade. After that, the blade carries the wafer at a very high speed without causing movement of the wafer onto the blade.