WIRE SAW

PROBLEM TO BE SOLVED: To provide such a wire saw as being capable of supplying sufficient cooling water to a cutting point under any circumstances and efficiently discharge chip accompanied by cutting. SOLUTION: A groove 1 to supply cooling water to a cutting point is formed in at least one place in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KOYANAGI SUSUMU, MIYAZAKI KENICHIRO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide such a wire saw as being capable of supplying sufficient cooling water to a cutting point under any circumstances and efficiently discharge chip accompanied by cutting. SOLUTION: A groove 1 to supply cooling water to a cutting point is formed in at least one place in the circumferential direction of an abrasive grain part 3 on a continuous or uncontinuous basis. In this way, chip accompanied by is cutting is also efficiently discharged through the groove 1, resulting in improved cutting performance.