APPARATUS FOR BUTT BONDING OF BOARDS BY HIGH-FREQUENCY HEATING

PROBLEM TO BE SOLVED: To prevent an adhesive overflowing from between adherends from spreading on and adhering to the surfaces of boards to be bonded in thermally bonding them by high-frequency induction heating under pressure with an adhesive interposed between them. SOLUTION: Boards A, A are place...

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Bibliographische Detailangaben
Hauptverfasser:	KODAMA JUNICHI, KURAKI ITSUO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY DYES ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NAILING OR STAPLING MACHINES IN GENERAL NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL WORKING VENEER OR PLYWOOD
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent an adhesive overflowing from between adherends from spreading on and adhering to the surfaces of boards to be bonded in thermally bonding them by high-frequency induction heating under pressure with an adhesive interposed between them. SOLUTION: Boards A, A are placed on a bearer 2 for holding them in the position for bonding and are held under pressure with press members 6, 6. Electrodes 4, 5 are each a rod having an about square U-shaped section and are installed so that the right and left points of the about square U-shaped section of one electrode are in contact with the right and left points of that of the other with adherends placed between the points of the electrodes. When a high-frequency voltage is applied in such a state, the adherends are heated and an adhesive interposed between them overflows but it is held in the grooves of the respective upper and lower electrodes without being spreaded.