STRUCTURE AND METHOD FOR MOUNTING OF SURFACE-MOUNTING CONNECTOR AS WELL AS PC CRAD STRUCTURE

PROBLEM TO BE SOLVED: To eliminate a soldering defect and to enhance the yield of a reflow soldering operation by a method wherein the position of the center of gravity of a connector body is formed so as to be put aside to the side of a part from which a lead is derived. SOLUTION: A printed-circuit...

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Bibliographische Detailangaben
1. Verfasser: KOYAMA KAZUNARI
Format: Patent
Sprache:eng
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