STRUCTURE AND METHOD FOR MOUNTING OF SURFACE-MOUNTING CONNECTOR AS WELL AS PC CRAD STRUCTURE

PROBLEM TO BE SOLVED: To eliminate a soldering defect and to enhance the yield of a reflow soldering operation by a method wherein the position of the center of gravity of a connector body is formed so as to be put aside to the side of a part from which a lead is derived. SOLUTION: A printed-circuit...

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Bibliographische Detailangaben
1. Verfasser:	KOYAMA KAZUNARI
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS RECOGNITION OF DATA RECORD CARRIERS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To eliminate a soldering defect and to enhance the yield of a reflow soldering operation by a method wherein the position of the center of gravity of a connector body is formed so as to be put aside to the side of a part from which a lead is derived. SOLUTION: A printed-circuit board 1 is set in a printed-circuit board positioning part 9A. Then, when a connector body part 6 is dropped into a connector positioning recessed part, a lead 7 at a connector 5 is set in a state that it is brought into contact with a solder paste on a foot pattern 4 at the printed-circuit board 1. At this time, since the connector body part 6 is set to a state that the position of its center of gravity is formed so as to be put aside to a side from which the lead 7 is derived, it is set in a state that the lead 7 is pressed to the foot pattern 4. After that, a reflow soldering operation is performed. Thereby, it is possible to restrain the lead 7 from being levitated from the foot pattern 4 at the printed-circuit board 1 in the halfway part of the reflow soldering operation. A soldering defect is eliminated, and the yield of the reflow soldering operation can be enhanced.