SOLDERING METHOD AND SOLDER REINFORCING TERMINAL

PROBLEM TO BE SOLVED: To provide a soldering method which does not require the readjustment after soldering by removing special facility or increase in number of processes. SOLUTION: When soldering the foot 2 of the lead of a part to the soldering pattern 5 of a printed board 3, a solder reinforcing...

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Bibliographische Detailangaben
Hauptverfasser: YAMABE TOSHIYUKI, SAITO YOSHIHIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a soldering method which does not require the readjustment after soldering by removing special facility or increase in number of processes. SOLUTION: When soldering the foot 2 of the lead of a part to the soldering pattern 5 of a printed board 3, a solder reinforcing terminal 7, which has a lead insertion hole 7a and projections 8a-8d to abut on the soldering pattern 5 of the printed board 3, is positioned and attached into the component hole 4 of the printed board 3. Then, the foot 2 of the lead of the component is passed through the lead insertion hole 7a of the solder reinforcing terminal 7 from the component hole 4 of the printed board 3, whereby the part is inserted, and they are soldered extending over the soldering patter 5, the solder reinforcing terminal 7, and the foot 2 of the lead of the component pierced from the lead insertion hole 7a of the solder reinforcing terminal 7.