MANUFACTURE OF SURFACE WHICH IMPROVES ADHESION OF DIELECTRIC LAYER
PROBLEM TO BE SOLVED: To improve connection of a dielectric material such as a ceramic material which is subjected to plasma flame-spraying and a lower surface such as a metallic electrostatic chuck pedestal by providing a dielectric material in close contact with a lower part material with an under...
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creator | DONDE ARIK |
description | PROBLEM TO BE SOLVED: To improve connection of a dielectric material such as a ceramic material which is subjected to plasma flame-spraying and a lower surface such as a metallic electrostatic chuck pedestal by providing a dielectric material in close contact with a lower part material with an under cut structure for bonding reinforcement to a surface of a lower material. SOLUTION: Basically, a dielectric insert 300 and a dielectric sleeve 320 are used as a plurality of inserts 320 arranged in a circumferential edge part of an electrostatic chuck. The dielectric insert 300 is set in a socket hole 313 and a bottom part of a boss 301 is mounted on a side surface part of the socket hole 313. A clearance between a bottom part of the dielectric insert 300 and a bottom part of a buried channel 312 remains. A tubular dielectric sleeve 320 is a right cylinder with an axial flow path 328. The flow path 328 passes through the dielectric sleeve 320 and can have a blind upper end part such as the insert 300. Thereby, adhesion of a dielectric material which constitutes a part of a surface structure can be improved. |
format | Patent |
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SOLUTION: Basically, a dielectric insert 300 and a dielectric sleeve 320 are used as a plurality of inserts 320 arranged in a circumferential edge part of an electrostatic chuck. The dielectric insert 300 is set in a socket hole 313 and a bottom part of a boss 301 is mounted on a side surface part of the socket hole 313. A clearance between a bottom part of the dielectric insert 300 and a bottom part of a buried channel 312 remains. A tubular dielectric sleeve 320 is a right cylinder with an axial flow path 328. The flow path 328 passes through the dielectric sleeve 320 and can have a blind upper end part such as the insert 300. 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SOLUTION: Basically, a dielectric insert 300 and a dielectric sleeve 320 are used as a plurality of inserts 320 arranged in a circumferential edge part of an electrostatic chuck. The dielectric insert 300 is set in a socket hole 313 and a bottom part of a boss 301 is mounted on a side surface part of the socket hole 313. A clearance between a bottom part of the dielectric insert 300 and a bottom part of a buried channel 312 remains. A tubular dielectric sleeve 320 is a right cylinder with an axial flow path 328. The flow path 328 passes through the dielectric sleeve 320 and can have a blind upper end part such as the insert 300. 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SOLUTION: Basically, a dielectric insert 300 and a dielectric sleeve 320 are used as a plurality of inserts 320 arranged in a circumferential edge part of an electrostatic chuck. The dielectric insert 300 is set in a socket hole 313 and a bottom part of a boss 301 is mounted on a side surface part of the socket hole 313. A clearance between a bottom part of the dielectric insert 300 and a bottom part of a buried channel 312 remains. A tubular dielectric sleeve 320 is a right cylinder with an axial flow path 328. The flow path 328 passes through the dielectric sleeve 320 and can have a blind upper end part such as the insert 300. Thereby, adhesion of a dielectric material which constitutes a part of a surface structure can be improved.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
title | MANUFACTURE OF SURFACE WHICH IMPROVES ADHESION OF DIELECTRIC LAYER |
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