MANUFACTURE OF SURFACE WHICH IMPROVES ADHESION OF DIELECTRIC LAYER

PROBLEM TO BE SOLVED: To improve connection of a dielectric material such as a ceramic material which is subjected to plasma flame-spraying and a lower surface such as a metallic electrostatic chuck pedestal by providing a dielectric material in close contact with a lower part material with an under...

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1. Verfasser: DONDE ARIK
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To improve connection of a dielectric material such as a ceramic material which is subjected to plasma flame-spraying and a lower surface such as a metallic electrostatic chuck pedestal by providing a dielectric material in close contact with a lower part material with an under cut structure for bonding reinforcement to a surface of a lower material. SOLUTION: Basically, a dielectric insert 300 and a dielectric sleeve 320 are used as a plurality of inserts 320 arranged in a circumferential edge part of an electrostatic chuck. The dielectric insert 300 is set in a socket hole 313 and a bottom part of a boss 301 is mounted on a side surface part of the socket hole 313. A clearance between a bottom part of the dielectric insert 300 and a bottom part of a buried channel 312 remains. A tubular dielectric sleeve 320 is a right cylinder with an axial flow path 328. The flow path 328 passes through the dielectric sleeve 320 and can have a blind upper end part such as the insert 300. Thereby, adhesion of a dielectric material which constitutes a part of a surface structure can be improved.