MANUFACTURE OF SEMICONDUCTOR DEVICE

MANUFACTURE OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To simply and cheaply form uniform-height electrodes of a bare IC. SOLUTION: A polyimide tape 14 is formed through an adhesive agent 13 on a chip 11 having an Al wiring 12. The tape 14 and adhesive agent 13 are selectively removed to form holes 15 into regions for forming elect...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MASUDA YOSHIKURA, OTANI RYUICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To simply and cheaply form uniform-height electrodes of a bare IC. SOLUTION: A polyimide tape 14 is formed through an adhesive agent 13 on a chip 11 having an Al wiring 12. The tape 14 and adhesive agent 13 are selectively removed to form holes 15 into regions for forming electrodes. A low m.p. metal such as solder is buried in the holes by the screen printing. The thickness of the tape 14 is reduced by etching to form bump-like electrodes 16 with protruded parts from the tape.