APPARATUS AND METHOD FOR REMOVING PARTICLES IN SEMICONDUCTOR PRODUCTION

PROBLEM TO BE SOLVED: To protect semiconductor elements outside and inside of a clean room by the semiconductor surface of the element being fabricated with a self- composed protective seal. SOLUTION: A semiconductor element 10 includes a Si substrate 12. An upper face 12 having an SiO2 layer 14 is...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JIYOOJI ENU MARAKASU, HAABAATO GORONKIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES NANOTECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To protect semiconductor elements outside and inside of a clean room by the semiconductor surface of the element being fabricated with a self- composed protective seal. SOLUTION: A semiconductor element 10 includes a Si substrate 12. An upper face 12 having an SiO2 layer 14 is formed on the upper part of the element 10. A bond layer 20 is deposited on the upper face 16 and has a self- composed protective seal 30 deposited thereto, so that the radicals composed of hydroxy (OH) group at the head part form Si-O bonds during self composition. The seal 30 can be removed it any time by such a standard manufacturing procedure for gasifying this film by ultraviolet rays or standard O-plasma. Thus it is possible to protect the element 10 outside and inside of a clean room.