AUTOMATIC MANUFACTURING SYSTEM FOR WAFER

PROBLEM TO BE SOLVED: To reduce burden on an operator and to attempt improvement in production efficiency and machining quality of an auytiamtic wafer manufacturing system. SOLUTION: An orientation measuring device 15 which measures a crystal orientation of an ingot 13, junctioning device 16 and 17 which junction a carbon plate and an attachment plate with the ingot 13, a drying device 18 which dries adhesive, and a stoker device 25 which contains the ingot 13 are provided. Additionally wire saw devices 26 which make slice machining, a slurry integrated control system 31 which makes integrated control of slurry, a carrying cart 32 which carries the ingot 13, a single-wafer processing cleaner 33 for a wafer which has been subjected to slice machining and a checking device 37 which checks the wafer are provided. Operations of these devices are controlled by a central controlling device 39.