LEAD FRAME FOR SEMICONDUCTOR PACKAGE AND LEAD FRAME STOP

PROBLEM TO BE SOLVED: To absorb a residual stress at the time of forming downset parts to minimize the deformation of a lead frame, by a method wherein diverse shapes of stress absorbing means are formed in the vicinities of an area where downset parts of fuse leads are to be formed. SOLUTION: Diverse shapes of stress absorbing means 5 are formed in the vicinities of downset parts 4 formed on fuse leads 3 in a lead frame 1 for semiconductor package. The fuse leads 3 are made to couple integrally with a semiconductor chip mounting plate 2 and a siderail. Owing to this, the curve or twisting phenomenon of the lead frame 1 or the strips of the lead frame 1 can be prevented from being generated by making a residual stress, which is generated at the time of a processing of the downset parts, absorb or relax by the means 5. Moreover, a coupling force between a molding resin and the lead frame can be made to enhance, by a method wherein a silver-plated region for ground bonding is formed on each one part of the means 5 and the relative ratio of the whole area of the silver-plated regions to the whole area of the fuse leads is minimized.