UNIT FOR CONNECTING ELECTRONIC COMPONENT TO BOARD

UNIT FOR CONNECTING ELECTRONIC COMPONENT TO BOARD

PROBLEM TO BE SOLVED: To improve heat shock resistance of a unit for connecting an electronic component to a board. SOLUTION: The unit 1 comprises an electronic component 2 having electrodes 4 with bumps 8, board 3 having electrodes 5, conductive connection members for electrically connecting the bu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: INOUE MASAJIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To improve heat shock resistance of a unit for connecting an electronic component to a board. SOLUTION: The unit 1 comprises an electronic component 2 having electrodes 4 with bumps 8, board 3 having electrodes 5, conductive connection members for electrically connecting the bumps 8 and terminals 5, and sealant for bonding the component 2 and board 3. They are set so that b>a and c>0.02mm; a is diameter of the bump 8, b is thickness of the sealant 6 between the component 2 and board 3, and c is gap between the bump top and terminal 5. This enough relaxes the thermal stress acting on a connection 10.