SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To enable failure analysis of a semiconductor chip wherein a solder bump and a gold bump are formed. SOLUTION: An aluminum pad is formed in a position adjacent to a solder bump and a gold bump on a semiconductor chip. When a failure is analyzed, wire bonding by a gold line is c...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KOBAYASHI SADAMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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