SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To enable failure analysis of a semiconductor chip wherein a solder bump and a gold bump are formed. SOLUTION: An aluminum pad is formed in a position adjacent to a solder bump and a gold bump on a semiconductor chip. When a failure is analyzed, wire bonding by a gold line is c...

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Bibliographische Detailangaben
1. Verfasser:	KOBAYASHI SADAMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To enable failure analysis of a semiconductor chip wherein a solder bump and a gold bump are formed. SOLUTION: An aluminum pad is formed in a position adjacent to a solder bump and a gold bump on a semiconductor chip. When a failure is analyzed, wire bonding by a gold line is carried out on the aluminum pad and failure analysis is executed. An aluminum pad 12 is formed on a semiconductor chip 10 in addition to an aluminum pad 11. Then, protection films 13, 14, 15 are formed respectively on the aluminum pads 11, 12. Thereafter, a solder bump 16 is formed on the aluminum pad 11. Since heat is applied to the solder bump 16 during mounting and a bump shape changes, wire bonding is carried out by a gold line on the aluminum pad 12 during failure analysis.