FLAT CIRCUIT BODY AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To improve the insulating characteristic of a first insulating film by fixing a third insulating film to a lower surface of the first insulating film. SOLUTION: A flat circuit body 1 is formed of a first insulating film 3 coated with the adhesive 2, a second insulating film 5 f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ISHITANI HAYAO, MEGURO KAZUHIDE, HIKOTANI TAKAYUKI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To improve the insulating characteristic of a first insulating film by fixing a third insulating film to a lower surface of the first insulating film. SOLUTION: A flat circuit body 1 is formed of a first insulating film 3 coated with the adhesive 2, a second insulating film 5 fixed to the adhesive 2 of the film 3 so as to cover flat conductors, which are adhered onto the adhesive 2 of the film 3, and a third insulating film 6 fixed to a lower surface of the film 3. Since the film 6 is fixed to the lower surface of the film 3, even in the case where the film 3 is damaged by a Victoria type steel blade or the like, insulating characteristic of the film 3 can be compensated by the film 6. Consequently, the circuit body 1 having the excellent insulating characteristic can be obtained. Since the film 3 is made of the material at a temperature lower than the melting temperature or the softening temperature of the film 5 and the film 6, the film 3 is melted or softened by the heat at the time of fixing the film 5 or the film 6 so as to repair the damage of the film 3 due to the blade.