FLAT CIRCUIT BODY AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To eliminate the thermo-compression bonding process at the time of adhering a flat conductor to the adhesive agent, and to eliminate an expensive heat roll as a manufacturing equipment by using the pressure sensitive viscous material having viscous adhesiveness at an ordinary t...

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Bibliographische Detailangaben
Hauptverfasser: ISHITANI HAYAO, HIKOTANI TAKAYUKI, MIYAHARA TOSHIO
Format: Patent
Sprache:eng
Schlagworte:
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Zusammenfassung:PROBLEM TO BE SOLVED: To eliminate the thermo-compression bonding process at the time of adhering a flat conductor to the adhesive agent, and to eliminate an expensive heat roll as a manufacturing equipment by using the pressure sensitive viscous material having viscous adhesiveness at an ordinary temperature as an adhesive agent. SOLUTION: A flat circuit body 1 is formed of a first insulating film 3 coated with the pressure sensitive adhesive 2, three flat conductors 4 adhered onto the pressure sensitive adhesive 2 of the film 3, and a second insulating film 5 fixed to the material 2 on the film 3 so as to cover the conductor 4. Since the adhesive 2 having adhesiveness at the ordinary temperature is used as the adhesive agent, at the time of fitting a metal foil to the adhesive 2, fitting can be performed by only pushing the metal foil to the adhesive 2, and a thermocompression bonding process is eliminated, and an expensive heat roll and heat press as a manufacturing equipment are eliminated. Thickness of the material 2 is set at 40-300% of the thickness of the conductor 4 so that the conductor 4 can be sufficiently protected in mechanical strength viewpoint and electrical viewpoint.