HEAT TRANSFER DEVICE FOR STRUCTURE
PROBLEM TO BE SOLVED: To provide a heat transfer device which transfers the heat between a structure such as a spacecraft and the circumference of the structure, is produced at low cost, and prevents a radiator panel from becoming unusable even in a case of damage of constitution parts. SOLUTION: A...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a heat transfer device which transfers the heat between a structure such as a spacecraft and the circumference of the structure, is produced at low cost, and prevents a radiator panel from becoming unusable even in a case of damage of constitution parts. SOLUTION: A heat transfer device is provided with a radiator panel 3 which is connected to a structure 1 for holding a condenser 4 and securing a folding position or a developing position 3b, and an evaporator 9 which is held by the structure 1 and connected to the condenser 4 by conduits 7, 8 for making the radiator panel developable, and the connected body of the condenser 4 and the evaporator 9 is formed into a capillary tube carrying two-phase loop and the radiator panel 3 holds, at least, one conduit 12 being brought in heat contact with the condenser 4. |
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