HEAT TRANSFER DEVICE FOR STRUCTURE

PROBLEM TO BE SOLVED: To provide a heat transfer device which transfers the heat between a structure such as a spacecraft and the circumference of the structure, is produced at low cost, and prevents a radiator panel from becoming unusable even in a case of damage of constitution parts. SOLUTION: A...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MOSCHETTI BERNARD, DURAND YANNICK, BARD MAX ROGER, AMIDIEU MARCEL JACQUES
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat transfer device which transfers the heat between a structure such as a spacecraft and the circumference of the structure, is produced at low cost, and prevents a radiator panel from becoming unusable even in a case of damage of constitution parts. SOLUTION: A heat transfer device is provided with a radiator panel 3 which is connected to a structure 1 for holding a condenser 4 and securing a folding position or a developing position 3b, and an evaporator 9 which is held by the structure 1 and connected to the condenser 4 by conduits 7, 8 for making the radiator panel developable, and the connected body of the condenser 4 and the evaporator 9 is formed into a capillary tube carrying two-phase loop and the radiator panel 3 holds, at least, one conduit 12 being brought in heat contact with the condenser 4.