EPOXY MOLDED TYPE SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To obtain superior adherence, reduce warping amount of a semiconductor device and improve thermal cycle property and popcorn resistance by including an epoxy resin, hardner, inorganic filler and silane-modified polymer as an epoxy resin composite, formed on only the single surface of a board. SOLUTION: A semiconductor device is provided with a semiconductor element 1, a board 2 on which the semiconductor element is mounted, and a hardening object 3 of an epoxy resin composite sealing the semiconductor element. The epoxy resin composite contains an epoxy resin, hardner, inorganic filler and a silane modified polymer. The epoxy resin contains at least two epoxy groups in one epoxy molecule, and the loading are made 2-15 wt.% in all composition. The silence polymer is an organic polymer having silicon atoms in a molecule, and the loadings are made 0.01-40 wt.% in all epoxy resin composites. As a result, adherence and reduction of warping amount of a package are superior, and thermal cycle property or the like of the semiconductor device can be improved.