WAFER-TRANSFER DEVICE WITH WAFER ERRONEOUS MOUNT DETECTION SENSOR, SEMICONDUCTOR-MANUFACTURING DEVICE WITH THE SAME, AND WAFER-TRANSFER METHOD USING THE SAME

PROBLEM TO BE SOLVED: To provide a wafer-transfer device for detecting an erroneously mounted wafer, a semiconductor-manufacturing device with the device, and a method for transferring wafers using the wafer-carrying device. SOLUTION: A number of photosensors 120 are provided at the vertical positio...

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Bibliographische Detailangaben
Hauptverfasser:	KIN KOSHU, BOKU SAIHAN, BOKU ZAISO, KO RYUIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HANDLING THIN OR FILAMENTARY MATERIAL PACKING PERFORMING OPERATIONS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wafer-transfer device for detecting an erroneously mounted wafer, a semiconductor-manufacturing device with the device, and a method for transferring wafers using the wafer-carrying device. SOLUTION: A number of photosensors 120 are provided at the vertical position of a wafer diameter where a plurality of wafers 114 are aligned before they are separated from a cassette 116 and are carried into a semiconductor- manufacturing device. Then, a wafer-transfer device 99 is used and the photosensors 120 are operated along the outer-periphery surface of the wafers 114 and light is applied, thus detecting whether the wafers 114 are mounted by mistake.