EPOXY RESIN COMPOSITION AND MOLDED VACUUM VALVE USING THE SAME

PROBLEM TO BE SOLVED: To obtain the subject composition, excellent in fluidity, having a low thermal expansion coefficient after curing and capable of forming a high- strength resin layer by including an epoxy resin, a curing agent and a specific inorganic filler therein. SOLUTION: This composition...

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Bibliographische Detailangaben
Hauptverfasser:	KAO MIN TAI, WAKABAYASHI HIROMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRIC SWITCHES ELECTRICITY EMERGENCY PROTECTIVE DEVICES INSULATORS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS RELAYS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SELECTORS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain the subject composition, excellent in fluidity, having a low thermal expansion coefficient after curing and capable of forming a high- strength resin layer by including an epoxy resin, a curing agent and a specific inorganic filler therein. SOLUTION: This composition contains (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler containing (i) glass fibers having 3-20 μm average diameter and 10-300 μm average length, (ii) a fused silica having 2-10 μm average particle diameter and (iii) a crystal silica having