INSERT RESIN MOLDING DEVICE

PROBLEM TO BE SOLVED: To provide an insert resin molding device that can reduce burrs on a molded product, improve sink marks, chipping and warping and stabilize the size of a molded piece, thickness dimension and molded resin density. SOLUTION: This device comprises a top force 3 that is vertically...

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Bibliographische Detailangaben
Hauptverfasser:	TONO HIROAKI, KITAGAWA TOMOKAZU, UEDA SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an insert resin molding device that can reduce burrs on a molded product, improve sink marks, chipping and warping and stabilize the size of a molded piece, thickness dimension and molded resin density. SOLUTION: This device comprises a top force 3 that is vertically movable, a bottom force 4 provided with a cavity portion 6 confronting the top force 3 and adapted to be freely vertically moved so as to form a shape of a desired molded piece and a frame 14, and a plunger 7 disposed in the cavity portion 6 so as to form a bottom of the cavity portion 6 and adapted to be slidingly inserted into the bottom force 4, and additionally comprises an overflow portion 8 provided in the vicinity of the cavity portion 6 to receive therein excessive molding resin and a movable plunger 9 for compressing the excessive molding resin so received, whereby a metallic terminal 1 having a connecting terminal 15 and a resin sheet 5 are integrally molded.