MOUNTING STRUCTURE AND MOUNTING METHOD FOR CHIP TYPE COMPONENT

PROBLEM TO BE SOLVED: To provide a structure and method that are suitable for a chip type component like a bare chip SAW filter which has a low tolerance to a shock and is easy to break. SOLUTION: A hole 13 is bored in a wiring board 11, on which a projection part 17 is formed of an elastic material...

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Bibliographische Detailangaben
Hauptverfasser:	EGUCHI TAKAHIRO, KODERA SADAO, TOKAWA YOSHIKUNI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a structure and method that are suitable for a chip type component like a bare chip SAW filter which has a low tolerance to a shock and is easy to break. SOLUTION: A hole 13 is bored in a wiring board 11, on which a projection part 17 is formed of an elastic material such as conductive paste so that at least part of the hole 13 is filled up. After conductive paste 21 is applied covering the projection part 17, the chip type component 20 is mounted on the wiring board 11 through the conductive paste 21 while a specific gap is held by the projection part 17 between the chip type component 20 and wiring board 11.