PLATE BENDING MACHINE

PROBLEM TO BE SOLVED: To conduct usual bendings as well as special bending for various plate thicknesses and materials. SOLUTION: A second pressure die 51 having a prescribed shape is set to a lower side of an upper pressure die 11 and/or an upper side of a lower pressure die 9 by a pair of left/rig...

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1. Verfasser: HEKIZONO TAKASHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To conduct usual bendings as well as special bending for various plate thicknesses and materials. SOLUTION: A second pressure die 51 having a prescribed shape is set to a lower side of an upper pressure die 11 and/or an upper side of a lower pressure die 9 by a pair of left/right second pressure die devices 15 arranged to a front face of an upper frame 7 and/or a lower part frame 3. At this state, the left/right second pressure dies 51 are connected, a plate material W is clamped in a wide range, the plate material W is bent by a bending die 13. A second pressure die holder is moved vertically by an elevating/lowering drive mechanism 23 of the second pressure die device 15 and is moved back/forth by a back and forth drive mechanism, the second pressure die 51 mounted to the second pressure die holder is set to a lower side of the upper pressure die 11 and/or an upper side of the lower pressure die 9.