PLATING DEVICE

PROBLEM TO BE SOLVED: To provide a plating bath of a plating device by which a highly uniform electrodepositing property is obtained in the production of a printed circuit board. SOLUTION: The shielding sheets 1 each having a definite width are vertically arranged at regular intervals at right angles to the printed circuit board as a material 4 to be plated, the shielding sheets 3 arranged in the horizontal direction of the shielding sheets 1 at regular intervals in the shape of squares on different levels are used to conduct plating. Consequently, the flow direction of an anode current in plating is controlled, the variation in thickness is eliminated in plating, a tensed chemical-resistant woven fabric 5 is spread in front of the square-shaped shielding sheet 3 to conduct plating, and the variation in the plating thickness is further improved. A rectangular plating bath 6 is used, anode 2 are arranged on both sides of the bath 6 in the longitudinal direction, and the material is vertically moved between the anodes 2 arranged on both sides and plated.