EPOXY RESIN COMPOSITION FOR POWDER COATING MATERIAL

PROBLEM TO BE SOLVED: To provide an epoxy resin compsn. for a powder coating material which can form a coating film having good flexibility and impact resistance and excellent in adhesiveness and resistances to water and corrosion. SOLUTION: This compsn. comprises 40-95 pts.wt. solid epoxy resin hav...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO YOUJIROU, WATANABE TAKAKO, MARUTA RIICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin compsn. for a powder coating material which can form a coating film having good flexibility and impact resistance and excellent in adhesiveness and resistances to water and corrosion. SOLUTION: This compsn. comprises 40-95 pts.wt. solid epoxy resin having at least two epoxy groups in the molecule, an epoxy equivalent of 400-2,500, and a softening point of 50-150 deg.C and 5-60 pts.wt. epoxidized polydiene polymer having a backbone represented by the formula: (A-B-Ap )n -Yr -(Aq -B)m (Y is a coupling agent residue; A is a polymer block selected from among a conjugated diene homopolymer block, a conjugated diene copolymer block, etc.; B is a polymer block selected from among a monoalkenylated arom. hydrocarbon homopolymer block, etc.; n is 0 or higher; r is 0 or 1; m is 0 or higher; the sum of n and m is 1-100; and the sum of p and q is 0 or 1) and having aliph. double bonds partially epoxidized.