MANUFACTURE OF MULTILAYERED PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method to manufacture a multilayered printed wiring board with high producibility and without an irregular surface. SOLUTION: This method is used for manufacturing a multilayered printed wiring board by piling a prepreg on the lower and lower surfaces of an inner layer material, further piling an outer layer material on the outermost parts thereof, piling a plurality of obtained layer constituent parts 1, and heating/ pressurizing them while they are sandwiched with metallic plates 3. In this case, a separating film 2 is piled on the upper and lower surfaces of the part 1 to make one set, and a plurality of sets are piled up while a caul 4 is inserted between the respective sets, and then they are sandwiched with metallic plates 3 and heated/pressurized. Thus, the multilayered printed wiring board can be prevented from generating any irregularity on its surface and a plurality of multilayered printed wiring boards be also manufactured with high producibility.