FORMATION OF PATTERN AND SURFACE-TREATING AGENT

PROBLEM TO BE SOLVED: To improve the adhesion between a semiconductor substrate and a resist pattern by forming a resist film on the surface of the substrate after the surface is treated with a surface treating agent containing a specific silane compound and the resist pattern by exposing and develo...

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Hauptverfasser: ENDO MASATAKA, OSAKI HIROMI
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creator ENDO MASATAKA
OSAKI HIROMI
description PROBLEM TO BE SOLVED: To improve the adhesion between a semiconductor substrate and a resist pattern by forming a resist film on the surface of the substrate after the surface is treated with a surface treating agent containing a specific silane compound and the resist pattern by exposing and developing the resist film by using a mask having a desired pattern shape. SOLUTION: The adhesion of the surface of a semiconductor substrate 1 to a resist pattern is improved by making the surface hidrophobic by using the silane compound expressed by the formula as a surface-treating agent. In the formula, R , R , R , and R respectively represent the same kind or different kinds of hydrogen atoms, 1-6C substituted or nonsubstituted saturated (or unsaturated) hydrocarbon groups, or 3-6C alicyclic saturated hydrocarbon groups and R , R , and R respectively represent the same kind or different kinds of hydrogen atoms, OR , 1-6C substituted or nonsubstituted saturated (or unsaturated) hydrocarbon groups, or 3-6C alicyclic saturated hydrocarbon groups.
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SOLUTION: The adhesion of the surface of a semiconductor substrate 1 to a resist pattern is improved by making the surface hidrophobic by using the silane compound expressed by the formula as a surface-treating agent. In the formula, R , R , R , and R respectively represent the same kind or different kinds of hydrogen atoms, 1-6C substituted or nonsubstituted saturated (or unsaturated) hydrocarbon groups, or 3-6C alicyclic saturated hydrocarbon groups and R , R , and R respectively represent the same kind or different kinds of hydrogen atoms, OR , 1-6C substituted or nonsubstituted saturated (or unsaturated) hydrocarbon groups, or 3-6C alicyclic saturated hydrocarbon groups.</description><edition>6</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19981009&amp;DB=EPODOC&amp;CC=JP&amp;NR=H10270306A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19981009&amp;DB=EPODOC&amp;CC=JP&amp;NR=H10270306A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ENDO MASATAKA</creatorcontrib><creatorcontrib>OSAKI HIROMI</creatorcontrib><title>FORMATION OF PATTERN AND SURFACE-TREATING AGENT</title><description>PROBLEM TO BE SOLVED: To improve the adhesion between a semiconductor substrate and a resist pattern by forming a resist film on the surface of the substrate after the surface is treated with a surface treating agent containing a specific silane compound and the resist pattern by exposing and developing the resist film by using a mask having a desired pattern shape. SOLUTION: The adhesion of the surface of a semiconductor substrate 1 to a resist pattern is improved by making the surface hidrophobic by using the silane compound expressed by the formula as a surface-treating agent. 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SOLUTION: The adhesion of the surface of a semiconductor substrate 1 to a resist pattern is improved by making the surface hidrophobic by using the silane compound expressed by the formula as a surface-treating agent. In the formula, R , R , R , and R respectively represent the same kind or different kinds of hydrogen atoms, 1-6C substituted or nonsubstituted saturated (or unsaturated) hydrocarbon groups, or 3-6C alicyclic saturated hydrocarbon groups and R , R , and R respectively represent the same kind or different kinds of hydrogen atoms, OR , 1-6C substituted or nonsubstituted saturated (or unsaturated) hydrocarbon groups, or 3-6C alicyclic saturated hydrocarbon groups.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
title FORMATION OF PATTERN AND SURFACE-TREATING AGENT
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