FORMATION OF PATTERN AND SURFACE-TREATING AGENT

PROBLEM TO BE SOLVED: To improve the adhesion between a semiconductor substrate and a resist pattern by forming a resist film on the surface of the substrate after the surface is treated with a surface treating agent containing a specific silane compound and the resist pattern by exposing and developing the resist film by using a mask having a desired pattern shape. SOLUTION: The adhesion of the surface of a semiconductor substrate 1 to a resist pattern is improved by making the surface hidrophobic by using the silane compound expressed by the formula as a surface-treating agent. In the formula, R , R , R , and R respectively represent the same kind or different kinds of hydrogen atoms, 1-6C substituted or nonsubstituted saturated (or unsaturated) hydrocarbon groups, or 3-6C alicyclic saturated hydrocarbon groups and R , R , and R respectively represent the same kind or different kinds of hydrogen atoms, OR , 1-6C substituted or nonsubstituted saturated (or unsaturated) hydrocarbon groups, or 3-6C alicyclic saturated hydrocarbon groups.