MANUFACTURE OF LAMINATED CHIP COMPONENT

PROBLEM TO BE SOLVED: To increase protruding amount of both end portions of an inner conductor formed of the conductive paste, improve connection ratio and pattern reproducibility of conductor paste, and ensure original characteristics by making contraction ratio due to baking of a first sheet on wh...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ISHINO AKIO, AMANO MASAMITSU, SAITO HIDEAKI
Format: Patent
Sprache:eng
Schlagworte:
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