MANUFACTURE OF LAMINATED CHIP COMPONENT
PROBLEM TO BE SOLVED: To increase protruding amount of both end portions of an inner conductor formed of the conductive paste, improve connection ratio and pattern reproducibility of conductor paste, and ensure original characteristics by making contraction ratio due to baking of a first sheet on wh...
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Zusammenfassung: | PROBLEM TO BE SOLVED: To increase protruding amount of both end portions of an inner conductor formed of the conductive paste, improve connection ratio and pattern reproducibility of conductor paste, and ensure original characteristics by making contraction ratio due to baking of a first sheet on which conductive paste is printed and a second sheet on which conductive paste is not printed to be different from each other. SOLUTION: Piles of a plurality of second sheets 16 on which silver paste 14 is not spread are laminated and fixed by pressure on the upper side and the lower side of a first sheet 12 on which the silver paste 14 is spread, cut into a specified chip shape, and backed. Outer conductors 22 are fixed on both end portions of the baked chip segment. Both end portions of an inner conductor 20 wherein the silver paste 14 is cured are connected with the outer conductors 22. The binder amount of the first sheet 12 is set to be 7.5 wt.%, the binder amount of the second sheet 16 is set to be 15 wt.%, and contraction ratio at the time of baking the second sheet 16 is made larger than that of the first sheet 12. |
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