HANGER

PROBLEM TO BE SOLVED: To provide a hanger which can easily hold a thin plate body even when warped and can stably execute a dipping treatment without dropping the plate body. SOLUTION: In the hanger, at least two clamps 5 are disposed at respective upper and lower frames 4 of a plate body supporting...

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Bibliographische Detailangaben
1. Verfasser:	FUJINAKA HIDEO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a hanger which can easily hold a thin plate body even when warped and can stably execute a dipping treatment without dropping the plate body. SOLUTION: In the hanger, at least two clamps 5 are disposed at respective upper and lower frames 4 of a plate body supporting member 1. In the hanger holding the plate body 3 with the clamps, a fixing member of the clamp is supported by the plate body supporting member 1, a pivot-supported link is provided between fixing members and a movable member for clamping the plate body is provided at an end of the link.