HEAT SINK

PROBLEM TO BE SOLVED: To provide a heat sink to which electronic components can be closely stuck, irrespective of difference of shapes of the electronic components and a chassis and difference of relative positions of the electronic components and the chassis. SOLUTION: This heat sink 3 is provided...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YOKOI KOUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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