HEAT SINK

PROBLEM TO BE SOLVED: To provide a heat sink to which electronic components can be closely stuck, irrespective of difference of shapes of the electronic components and a chassis and difference of relative positions of the electronic components and the chassis. SOLUTION: This heat sink 3 is provided with heat dissipating members 10 and a heat conducting member 20. The heat dissipating members 10 are composed of zink and made in almost column shapes, and have flexibility. The heat conducting member 20 is composed of silicon rubber containing alumina and made in a sheet shape, and has flexibility and thermal conductivity. The heat dissipating members 10 and the heat conducting member 20 are transformed corresponding to the shapes of fixing parts.