PRODUCTION OF ADHESIVE TAPE FOR ELECTRONIC PART

PROBLEM TO BE SOLVED: To provide a production process whereby an adhesive tape for electronic parts comprising at least two adhesive layers formed at a low temp. can be produced at a low cost with a min. coating apparatus and a common press laminator even when the adhesive has a high glass transitio...

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Bibliographische Detailangaben
Hauptverfasser:	HASHIMOTO TAKESHI, KOMAGATA FUMITADA, TOCHIHIRA JIYUN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a production process whereby an adhesive tape for electronic parts comprising at least two adhesive layers formed at a low temp. can be produced at a low cost with a min. coating apparatus and a common press laminator even when the adhesive has a high glass transition point. SOLUTION: This process comprises the step of forming the first adhesive layer 1 on one side of a substrate to give an adhesive film (a), the step of forming the second adhesive layer 3 on one side of a substrate to give an adhesive film (b), the step of applying a coating soln. obtd. from an org.-solvent- soluble adhesive to the surface of the adhesive layer of either the adhesive film (a) or the adhesive film (b) and drying the applied soln. to form an org.- solvent-contg. adhesive layer 2 to give an adhesive film (c), and the step of stacking the adhesive film (c) and the adhesive film (a) or (b) which is not used for producing the adhesive film (c) so that the org.-solvent-contg. adhesive layer of the former faces to the surface of the adhesive layer of the latter and then pressing them together.