LIGHT EMITTING MODULE FOR LIGHT COMMUNICATION

PROBLEM TO BE SOLVED: To realize a light communication light emitting module which is excellent in heat dissipating properties and capable of operating on a G bit/s band at an ultra-high speed by a method wherein an LD driver IC is mounted direct on a heat sink through the intermediary of no board, and an LD and the LD driver IC are directly connected together with a bonding wire. SOLUTION: An LD 1 is mounted on a sub-mount 2 together with a sub- carrier 6 mounted with a PD 5 and a temperature detecting thermistor 8, and the sub-mount 2 is arranged on a Peltier device 3. On the other hand, an LD driver IC 4 is mounted direct on a heat sink 10. A board 9 is partly cut out so as not to impede the mounting of the LD driver IC 4 and mounted on the heat sink 10. Electrical signals are inputted into the LD driver IC 4 through a wiring pattern 7 on the board 9 and a bonding wire 12 between the board 9 and the LD driver IC 4. Drive signals are transmitted direct from the LD driver IC 4 to the LD 1 through the bonding wire 12.