EMBOSSED MOLDED PRODUCT AND MOLD THEREFOR

PROBLEM TO BE SOLVED: To develop appearance having a high-grade feeling even if there is a wall thickness change of specific times or more. SOLUTION: An embossed molded product is composed of a resin compsn. and has embosses formed to at least a part of its surface and equipped with a non-uniform wa...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	SUZUKI TSUGIO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To develop appearance having a high-grade feeling even if there is a wall thickness change of specific times or more. SOLUTION: An embossed molded product is composed of a resin compsn. and has embosses formed to at least a part of its surface and equipped with a non-uniform wall part having thickness 1.5 times or more that of the thinnest part and characterized by that the surface roughness of embossed parts is 0.8-15μm as center line average roughness. A mold wherein the heat conductivity of a mold material 3a for the non-uniform thickness part forming the non- uniform thickness part molding surface 11a of a movable core is higher than that of the mold material 3b forming a main surface molding surface 11b is used. The center line average roughness of the emboss forming surface 12 of the mold 10 is set to 0.8-15μm.