METHOD AND APPARATUS FOR MANUFACTURING METHOD OF CERAMIC SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method and an apparatus for the manufacture of a ceramic substrate, in which the warpage of the ceramic substrate is suppressed to be small, and in which the generation of a crack and an expansion by a firing process can be prevented. SOLUTION: In a process in whic...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	IMAZU SHINJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and an apparatus for the manufacture of a ceramic substrate, in which the warpage of the ceramic substrate is suppressed to be small, and in which the generation of a crack and an expansion by a firing process can be prevented. SOLUTION: In a process in which a green-sheet laminated body 10 is fired, spacers 4 whose material is identical to that of the green-sheet laminated body 10 are used as supports, the green-sheet laminated body 10 is sandwiched between a setter 3 and a setter 5, and the height (h) of the spacers 4 is set to be larger than the thickness (t) of the green-sheet laminated body 10 according to the standard tolerance of the warpage of a ceramic substrate. As a result, the shrinkage percentage of the green-sheet laminated body 10 and that of the spacers 4 become identical, and it is possible to prevent a gap 6 from becoming large. Consequently, the warpage of the ceramic substrate can be suppressed to be within the range of the standard tolerance.