SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To make easy the application of a solder resist composition by a roll coater and reduce the migration of lead from it, by making it contain both the acrylate of a novolak type epoxy resin and an imidazole hardening agent, and by adjusting its viscosity to a specific scope at a...

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Bibliographische Detailangaben
Hauptverfasser:	GOTO AKIHIKO, ONO YOSHITAKA, NIKI NORIO, ASAI MOTOO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To make easy the application of a solder resist composition by a roll coater and reduce the migration of lead from it, by making it contain both the acrylate of a novolak type epoxy resin and an imidazole hardening agent, and by adjusting its viscosity to a specific scope at a specific temperature, using a glycolic ether-based solvent. SOLUTION: A solder resist composition contains both the acrylate of the novolak type epoxy resin obtained by the reaction of the glycidyl ether of either phenol novolak or crezol novolak on either acrylic acid or methacrylic acid and such a liquid imidazole hardening agent as 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, and 4-methyl-2-ethylimidazole. Further, its viscosity is adjusted to 0.5-10Pa.s at 25 deg.C, using a kind of glycol ether-based solvent selected for diethylene glycol dimethyl ether and triethylene glycol dimethyl ether.