CVD EQUIPMENT AND CVD METHOD

CVD EQUIPMENT AND CVD METHOD

PROBLEM TO BE SOLVED: To improve the yield of products by reducing particles sticking to a wafer. SOLUTION: An in-line particle monitor 17 is installed in piping 16 for monitoring particles which is fixed to a reaction furnace 1. Particles formed in the course of reaction in the reaction furnace 1 a...

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Bibliographische Detailangaben
1. Verfasser: MORI KENZO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To improve the yield of products by reducing particles sticking to a wafer. SOLUTION: An in-line particle monitor 17 is installed in piping 16 for monitoring particles which is fixed to a reaction furnace 1. Particles formed in the course of reaction in the reaction furnace 1 are measured with the monitor 17. When the measured value becomes lower than or equal to a set value, a wafer 12 is carried in the reaction furnace 1. Thereby the sticking of particles 14 to the wafer 12 is reduced when the wafer 12 is carried in the reaction furnace 1.