SINGLE-WAFER CLEANING DEVICE

PROBLEM TO BE SOLVED: To markedly shorten the cleaning time of a single-wafer cleaning device, and at the same time, to improve the cleaning processing capability of the cleaning device even though the device cleans wafers one by one. SOLUTION: Since a cleaning solution is jetted upon the upper and lower surfaces of a wafer 30 from an exhaust nozzle 22, provided in a cleaning tank 20 and another exhaust nozzle provided on a stage 50 side, pure cleaning water is always supplied to the upper and lower surfaces of the wafer 30. Therefore, metal powder, organic matters, adhering particles, etc., which are produced in various treating processes can be surely washed away, simultaneously from both the upper and lower surfaces of the wafer 30. It is also possible to vertically arrange a plurality of cleaning tanks, by putting one tank upon another tank so as to clean a plurality of wafers 30 at a time.