MANUFACTURE OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent a crack and a cut-out from being developed when performing the dicing of a semiconductor wafer from a reverse side by adding a coat film to the entire surface of a semiconductor wafer including a street and then performing the dicing of the semiconductor wafer from t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OHIRO MASAHIKO, OSAKI HIROTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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